研究業績

2017年度 学術論文

  • 金森元気, 安田敬一郎, 渡辺充広, 本間英夫, 高井治, "スルファミン酸浴から形成したニッケル-マンガン電析合金めっきの物性評価", 表面技術, vol. 68, No. 10, pp. 564-569(2017).

 

  • Genki KANAMORI, Mitsuhiro WATANABE, Hideo HONMA, Osamu TAKAI, "Integral formation of circuit and bump by plating process without Chemical Mechanical Polishing (CMP)", Material Science and Technology of Japan, vol. 54, No. 6, pp. 223-228(2017).

 

  • 上山秀明, 高井治, "アンバランスドマグネトロンスパッタリング法によるDLC膜の成膜と摺動特性", 材料の科学と工学, vol.54, No.5, pp. 169-174(2017).

 

  • 里見宣彦, 金山信幸, 石塚はるか, 渡邊陽一, 高井治, "アクティブスクリーン低温プラズマ浸炭によるγ系ステンレス鋼に形成された拡張オーステナイト相のミクロ組織と機械的特性", 熱処理, vol.58, No.1, pp.17-24(2018).

 

  • 野村太郎, 中林祐稀, 田代雄彦, 梅田泰, 本間英夫, 高井治, "大気UV処理を施したポリフェニレンサルファイド(PPS)樹脂へのめっき皮膜形成",表面技術, vol. 68, No. 11, pp. 624-629(2017).

 

  • 野村太郎, 田代雄彦, 梅田泰, 本間英夫, 高井治,"高圧UVランプにより改質したABS樹脂のメタライゼーション", 材料の科学と工学, vol. 54, No.6, pp. 193-198(2017).

 

  • 杉本薫, 中川隆, 菅野誠一, 渡邊充広, 本間英夫,"導電性ペーストビアの形成における多層積層条件の影響",材料の科学と工学, vol.54, No.2, pp. 28-32(2017).

 

  • 杉本薫, 河合憲一, 安達裕幸, 水谷大輔, 赤星知幸, 横内貴志男, 渡邊充広, 本間英夫, "高速伝送基板におけるVia 構造とその近傍配線が伝送損失に与える影響", エレクトロニクス実装学会誌, vol.20, No.4, pp. 196-202(2017).

 

  • 杉本薫, 大澤知徳, 河合憲一, 切中将樹, 水谷大輔, 渡邊充広, 本間英夫, "多層プリント配線板における導体表面粗度が高速伝送に与える影響", 表面技術, vol.69, No.1, pp. 38-45(2018).

 

  • Jong-Young PARK, Young-Jae KIM,Joo-Hyong NOH, Hideo HONMA, "Improvement of Cu-pillar Structure using Advanced Plating Method", Journal of Materials Science and Engineering, vol. B-7, No.11-12, pp.247-251(2017).

 

  • Y. Miyazeki, Y. Suzuki, Y. Horiuchi, J. –H. Noh, H. Honma, and T. Arakawa, "Multi-shot flash lamp annealing method for electroless-plated Ni-P film on UV-surface-modified ABS" Transactions of the IMF, vol.96, No.2, pp.103-107(2018).

 

  • Katsuyuki FUJIMURA, Katsuhiko TASHIRO, Shuji YAMAMOTO and Osamu TAKAI, "Sliding Characteristics of Rubber O-ring Coated by Diamond-like Carbon (DLC) in medium Vacuum", The Materials Science Society of Japan, vol.55 No.1 pp.21-25(2018).

 

  • Norifumi MIYANAGA, Shigeaki MINAMIKAWA, Jun TOMIOKA,"Effect of Acid Washing of SiC Particles on Dispersing and Friction Properties of Ni-P-SiC Composite Plating",Key Engineering Materials, vol. 739, pp. 143-147(2017).

 

  • Sudhagar Pitchaimuthu, Kaede Honda, Shoki Suzuki, Akane Naito, Norihiro Suzuki, Ken-ichi Katsumata, Kazuya Nakata, Naoya Ishida, Naoto Kitamura, Yasushi Idemoto, Takeshi Kondo, Makoto Yuasa, Osamu Takai, Tomonaga Ueno, Nagahiro Saito, Akira Fujishima, and Chiaki Terashima, "Solution Plasma Process-Derived Defect-Induced Heterophase Anatase/Brookite TiO2 Nanocrystals for Enhanced Gaseous Photocatalytic Performance", American Chemical Society, Omega 2018, 3, pp.898-905(2018).

 

  • Yuki Nakabayashi, Yasushi Umeda, Katsuhiko Tashiro, Hideo Honma, Hiroaki Kozai, "Influence of Modification on the ABS Plastics Using Atmospheric UV Irradiation as Plating Pretreatment", Journal of Materials Science and Engineering B, vol.7, No.6, pp.272-277(2017).
  • Nobuhiko Satomi, Nobuyuki Kanayama, Youichi Watanabe, Osamu Takai, "Effects of Heat Treatment Conditions on Formation of Expanded-Austenite Phase in Austenitic Stainless Steels by Combining Active Screen and DC Plasma Carburizing Processes Materials" ,Transactions, vol.58, No8, pp.1181-1189 (2017).

 

  • Yasushi Inoue, Haruka Koike, Takumi Aihara, Osamu Takai, "Influence of Substrate Materials on Deposition of Plasma-polymerized SiO:CH Particles", Journal of Photopolymer Science and Technology, vol. 30, No. 3, pp. 337-340 (2017).

 

  • Yasuhiro Suzuki, Nobuhiro Iguchi, Kazuhiro Adachi, Akihisa Ichiki, Tatsumi Hioki, Che-Wei Hsu, Ryoto Sato, Shinya Kumagai, Minoru Sasaki, Joo-Hyong Noh, Yuuske Sakurahara, Kyohei Okabe, Osamu Takai, Hideo Honma, Hideo Watanabe, Hitoshi Sakoda, Hiroaki Sasagawa, Hideyuki Doy, Shuliang Zhou, H. Hori, Shigeaki Nishikawa, Toshihiro Nozaki, Noriaki Sugimoto, Tomoyoshi Motohiro, "Complete Fabrication of a Traversable 3 μm Thick NbN Film Superconducting Coil with Cu plated layer of 42m in Length in a Spiral Three-Storied Trench Engraved in a Si Wafer of 76.2 mm in Diameter Formed by MEMS Technology for a Compact SMES with High Energy Storage volume Density", Journal of Physics: Conference Series, vol. 897, 012019(2017).

 

  • Junki Oshikiri, Atushi Kosuge,Yousuke Iimori,Mituhiro Watanabe,Hideo Honma,Osamu Takai, "High-Adhesion Plating on ABS Resin using High-power UV Irradiation", 表面技術, vol.68, No4, pp.49-52(2017).

 

  • 加藤友人, 寺島肇, 渡邊秀人, 渡邊充広, 本間英夫, 高井治, "銅配線上への無電解パラジウム/金めっきに及ぼす脱脂処理およびソフトエッチング処理の影響", 表面技術 68巻8号, vol.68, No.8, pp.39-45(2017).

 

  • Junki Oshikiri, Atushi Kosuge, Yousuke Iimori, Mituhiro Watanabe,Hideo Honma, Osamu Takai, "High Adhesion Plating on Smooth Resin Surfaces using a High-power UV Lamp", Transactions of The Japan Institute of Electronics Packaging, vol.10, pp.E16-018-1-E16-018-6(2017).

 

  • Aung Myin Oo, Mitsuhiro Watanabe, Hideo Honma and Osamu Takai, "Direct Pattern Formation by Electroless Anisotropic Growth Copper Plating on Liquid Crystal Polymer Using Selective UV Irradiation", The Materials Science Society of Japan, vol.55 No.1 pp.36-40(2018).

 

  • 久津内浩二, 渡辺充広, 遠藤充輝, 宮澤慎介, 本間英夫, 高井治, "シクロオレフィンポリマー繊維へのメタライジング", 材料の科学と工学, vol.55 No.1, pp.26-30(2018).

 

  • Christopher E. J. Cordonier, Kyohei Okabe, Yoshio Horiuchi, Akimasa Nakamura, Kaoru Ishikawa, Shozo Seino, Shinsuke Takagi, and Hideo Honma, "Formation of Micrometer Scale Metal Structures on Glass by Selective Electroless Plating on Photopatterned Titanium and Copper Containing Films", Langmuir 2017, vol. 33, 14571−14579

 

  • 盧 柱亨, IoTを支える電子材料と表面処理技術, 表面技術, 68巻8号, vol.68, No.7, pp.397-400(2017). 

 

  • Daisuke Shobara, Joo-Hyong Noh and Taro Arakawa, Design of Multi-Width Multimode Interface TE-TM Mode Splitter Considering Form Birefringence, The ICICE Transactions of Electronics, vol. J100-C, No. 5, 259-260(2017).

 

  • 堀内 義夫, "選択的 UV 改質処理を用いた樹脂上の金属パターン形成 ", 表面技術, vol.69 No.2, pp.65-69(2018).